Composite material with high thermal conductivity using aluminum nitride


In the FRP material-based industry, thermal conductivity is one of the concerns.

This is because as information technology advances, the processing load required for communication equipment increases, while the equipment itself is required to be lighter and smaller.

Since calculation processing speed is inversely proportional to heat, efficient heat dissipation is required.


FRP and thermal conductivity have been covered in the following columns in the past.


*Related column

Basics of FRP fiber orientation evaluation and thermal conductivity using thermal conductivity properties (Japanese only)


Today, I would like to introduce aluminum nitride and composite materials using it as a reinforcing fiber, which is being worked on by a company called U-MAP, which started as an industrial materials venture at Nagoya University in Japan.



Reinforcing by aluminum nitride whisker

In U-MAP, the reinforcing fiber is called Thermalnite (R).

It is a fiber-shaped aluminum nitride single crystal with a thickness of about several μm, and exhibits a very high thermal conductivity of 247 W/mK.

It is stated that they have reached the stage of highly efficient synthesis of aluminum nitride whiskers by liquid-vapor phase epitaxy.


*Related information

What is Aluminum Nitride Whisker for Thermal Management?



Composite material reinforced by Thermalnite(R)

Due to the fiber shape, the aspect ratio is large, so when Thermalnite (R) is added as a reinforcing fiber to a matrix resin or rubber, the fibers come into contact with each other to increase the heat transfer efficiency.

As a result, it seems that it is possible to increase the thermal conductivity of the composite material with a smaller addition amount (approximately 10 to 40 wt%) compared to conventional high thermal conductivity fillers, which are required to be added in an amount of approximately 60 to 90 wt%.


Furthermore, it is expected that a synergistic effect will be produced by combining conventional spherical fillers and Thermalnite(R).


Composite materials with high thermal conductivity are expected to be applied to sealing materials and adhesives for heat-generating information processing equipment such as servers and smartphones.


*Related information

High thermal conductivity composite resin material




As I have said several times, FRP is not only a structural member, but also

“Functional Materials”

A standing position is required.


From that point of view, we believe that “thermal conductivity” is an important technical axis.



We would like to support the evolution of FRP materials into functional materials by referring to the materials introduced this time.


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